Datasheet

PIC16F818/819
DS39598E-page 160  2004 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
0.38-0.22.015-.009BLead Width
8°4°0°8°4°0°
f
Foot Angle
0.25-0.09.010-.004
c
Lead Thickness
0.950.750.55.037.030.022LFoot Length
7.507.20.295.289.283.272DOverall Length
5.605.305.00.220.209.197E1Molded Package Width
8.207.807.40.323.307.291EOverall Width
--0.05--.002A1Standoff
1.851.751.65.073.069.065A2Molded Package Thickness
2.00--.079--AOverall Height
0.65.026
p
Pitch
2020
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
2
1
D
p
n
B
E
E1
L
c
f
A2
A
A1
shall not exceed .010" (0.254mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
Notes:
JEDEC Equivalent: MO-150
Drawing No. C04-072
*Controlling Parameter
Revised 11/03/03