Datasheet

PIC16F7X
DS30325B-page 158  2002 Microchip Technology Inc.
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom
1510515105
α
Mold Draft Angle Top
17.2716.5115.75.680.650.620eBOverall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.270.76.070.050.030B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.05.135.130.120LTip to Seating Plane
52.4552.2651.942.0652.0582.045DOverall Length
14.2213.8413.46.560.545.530E1Molded Package Width
15.8815.2415.11.625.600.595EShoulder to Shoulder Width
0.38.015
A1
Base to Seating Plane
4.063.813.56.160.150.140A2Molded Package Thickness
4.834.454.06.190.175.160ATop to Seating Plane
2.54.100
p
Pitch
4040
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
A2
1
2
D
n
E1
c
β
eB
E
α
p
L
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
§ Significant Characteristic