Datasheet

 2002 Microchip Technology Inc. DS30325B-page 157
PIC16F7X
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) (Continued)
Pad Width
*Controlling Parameter
Drawing No. C04-2114
B .009.011.0140.230.280.35
Pitch
MAX
Units
Dimension Limits
p
INCHES
.026 BSC
MIN NOM MAX
MILLIMETERS*
MIN
0.65 BSC
NOM
Pad Length
Pad to Solder Mask
L .020 .024 .030 0.50 0.60 0.75
M.005 .0060.13 0.15
L
p
M
M B
PACKAGE
EDGE
SOLDER
MASK