Datasheet

PIC16F7X
DS30325B-page 156  2002 Microchip Technology Inc.
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
Lead Width
*Controlling Parameter
Notes:
Mold Draft Angle Top
B
α
.009
12
.011 .014 0.23
12
0.28 0.35
D
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM MAX
0.65
.031
.002 0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
.008 REF.Base Thickness
A3
0.20 REF.
TOP VIEW
0.85.033
.0004 0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Q
L
Lead Length
Tie Bar Width
L .020.024.0300.500.600.75
R .005.007.0100.130.170.23
Tie Bar Length
Q
.012 .016 .026 0.30 0.40 0.65
Chamfer CH .009.017.0240.240.420.60
R
p
A1
A3
α
CH x 45
B
D2
E2
E2
D2
Exposed Pad Width
Exposed Pad Length
.140 .146 .152 3.55 3.70 3.85
.140 .146 .152 3.55 3.70 3.85
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114