Datasheet

 2002 Microchip Technology Inc. DS30325B-page 121
PIC16F7X
15.1 DC Characteristics: PIC16F73/74/76/77 (Industrial, Extended)
PIC16LF73/74/76/77 (Industrial)
PIC16LF73/74/76/77
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial
PIC16F73/74/76/77
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
V
DD Supply Voltage
D001 PIC16LF7X 2.5
2.2
2.0
—
—
—
5.5
5.5
5.5
V
V
V
A/D in use, -40°C to +85°C
A/D in use, 0°C to +85°C
A/D not used, -40°C to +85°C
D001
D001A
PIC16F7X 4.0
V
BOR*
-
-
5.5
5.5
V
V
All configurations
BOR enabled (Note 7)
D002* V
DR RAM Data Retention
Voltage (Note 1)
-1.5-V
D003 V
POR VDD Start Voltage to
ensure internal Power-on
Reset signal
-V
SS - V See section on Power-on Reset for details
D004* SVDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 - - V/ms See section on Power-on Reset for details
D005 V
BOR Brown-out Reset Voltage 3.65 4.0 4.35 V BODEN bit in configuration word enabled
Legend: Shading of rows is to assist in readability of of the table.
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from-rail to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from character-
ization and is for design guidance only. This is not tested.
6: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the V
BOR voltage trip point is reached.