Datasheet

PIC16(L)F722A/723A
DS41417B-page 208  2010-2012 Microchip Technology Inc.
23.5 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to Ambient 60.0 C/W 28-pin SPDIP package
69.7 C/W 28-pin SOIC package
71.0 C/W 28-pin SSOP package
52.5 C/W 28-pin UQFN 4x4mm package
30.0 C/W 28-pin QFN 6x6mm package
TH02 
JC Thermal Resistance Junction to Case 29.0 C/W 28-pin SPDIP package
18.9 C/W 28-pin SOIC package
24.0 C/W 28-pin SSOP package
16.7 C/W 28-pin UQFN 4x4mm package
5.0 C/W 28-pin QFN 6x6mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature
3: T
J = Junction Temperature