Datasheet

PIC16F72
DS39597C-page 90 © 2007 Microchip Technology Inc.
IDD Supply Current (Notes 2, 5)
D010
D010A
PIC16LF72 —
—
0.4
25
2.0
48
mA
μA
XT, RC osc configuration
F
OSC = 4 MHz, VDD = 3.0V (Note 4)
LP osc configuration
FOSC = 32 kHz, VDD = 3.0V, WDT disabled
D010
D013
PIC16F72 -
—
0.9
5.2
4
15
mA
mA
XT, RC osc configuration
F
OSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
F
OSC = 20 MHz, VDD = 5.5V
D015* ΔI
BOR Brown-out Reset Current
(Note 6)
— 25 200 μA BOR enabled, VDD = 5.0V
I
PD Power-down Current (Notes 3, 5)
D020
D021
PIC16LF72 —
—
2.0
0.1
30
5
μA
μA
V
DD = 3.0V, WDT enabled, -40°C to +85°C
V
DD = 3.0V, WDT disabled, -40°C to +85°C
D020
D021
PIC16F72 — 5.0
0.1
42
19
μA
μA
VDD = 4.0V, WDT enabled, -40°C to +85°C
V
DD = 4.0V, WDT disabled, -40°C to +85°C
D023* ΔIBOR Brown-out Reset Current
(Note 6)
— 25 200 μA BOR enabled, VDD = 5.0V
14.1 DC Characteristics:PIC16F72 (Industrial, Extended)
PIC16LF72 (Industrial) (Continued)
PIC16LF72
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC16F72
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption. The test conditions for all I
DD measurements in active Operation mode
are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kΩ.
5: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from
characterization and is for design guidance only. This is not tested.
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the V
BOR voltage trip point is reached.