Datasheet

PIC12F635/PIC16F636/639
DS41232D-page 220 © 2007 Microchip Technology Inc.
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Package is saw singulated.
3
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 16
Pitch e 0.65 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 4.00 BSC
Exposed Pad Width E2 2.50 2.65 2.80
Overall Length D 4.00 BSC
Exposed Pad Length D2 2.50 2.65 2.80
Contact Width b 0.25 0.30 0.35
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –
D
E
N
2
1
EXPOSED
PAD
D2
E2
2
1
e
b
K
N
NOTE 1
A3
A1
A
L
TOP VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-127
B