Datasheet

PIC12F635/PIC16F636/639
DS41232D-page 218 © 2007 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL or OD) – Narrow, 3.90 mm Body [SOIC]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. § Significant Characteristic.
3
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 14
Pitch e 1.27 BSC
Overall Height A – – 1.75
Molded Package Thickness A2 1.25 – –
Standoff § A1 0.10 – 0.25
Overall Width E 6.00 BSC
Molded Package Width E1 3.90 BSC
Overall Length D 8.65 BSC
Chamfer (optional) h 0.25 – 0.50
Foot Length L 0.40 – 1.27
Footprint L1 1.04 REF
Foot Angle φ 0° – 8°
Lead Thickness c 0.17 – 0.25
Lead Width b 0.31 – 0.51
Mold Draft Angle Top α 5° – 15°
Mold Draft Angle Bottom β 5° – 15°
NOTE 1
N
D
E
E1
1
2 3
b
e
A
A1
A2
L
L1
c
h
h
α
β
φ
Microchip Technology Drawing C04-065
B