Datasheet

PIC12F635/PIC16F636/639
DS41232D-page 216 © 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
N
otes:
1
. Pin 1 visual index feature may vary, but must be located within the hatched area.
2
. Package may have one or more exposed tie bars at ends.
3
. Package is saw singulated.
4
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 1.27 BSC
Overall Height A 0.80 0.85 1.00
Standoff A1 0.00 0.01 0.05
Contact Thickness A3 0.20 REF
Overall Length D 5.00 BSC
Overall Width E 6.00 BSC
Exposed Pad Length D2 3.90 4.00 4.10
Exposed Pad Width E2 2.20 2.30 2.40
Contact Width b 0.35 0.40 0.48
Contact Length L 0.50 0.60 0.75
Contact-to-Exposed Pad K 0.20 – –
NOTE 2
A1
A
A3
NOTE 1
12
E
N
D
EXPOSED PAD
NOTE 1
2
1
E2
L
N
e
b
K
BOTTOM VIEW
TOP VIEW
D2
Microchip Technology Drawing C04-122
B