Datasheet

Table Of Contents
2002 Microchip Technology Inc. Preliminary DS40044A-page 153
PIC16F627A/628A/648A
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN)
Lead Width
*Controlling Parameter
Notes:
Mold Draft Angle Top
B
α
.009
12
.011 .014 0.23
12
0.28 0.35
D
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM MAX
0.65
.031
.002 0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
.008 REF.Base Thickness
A3
0.20 REF.
TOP VIEW
0.85.033
.0004 0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Q
L
Lead Length
Tie Bar Width
L .020 .024 .030 0.50 0.60 0.75
R .005 .007 .010 0.13 0.17 0.23
Tie Bar Length
Q
.012 .016 .026 0.30 0.40 0.65
Chamfer CH .009 .017 .024 0.24 0.42 0.60
R
p
A1
A3
α
CH x 45
B
D2
E2
E2
D2
Exposed Pad Width
Exposed Pad Length
.140 .146 .152 3.55 3.70 3.85
.140 .146 .152 3.55 3.70 3.85
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: M0-220
Drawing No. C04-114