Datasheet

PIC16F62X
DS40300C-page 158 Preliminary  2003 Microchip Technology Inc.
K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
1510515105
β
Mold Draft Angle Bottom
1510515105
α
Mold Draft Angle Top
10.929.407.87.430.370.310
eB
Overall Row Spacing §
0.560.460.36.022.018.014BLower Lead Width
1.781.461.14.070.058.045B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.18.135.130.125LTip to Seating Plane
22.9922.8022.61.905.898.890DOverall Length
6.606.356.10.260.250.240
E1
Molded Package Width
8.267.947.62.325.313.300EShoulder to Shoulder Width
0.38.015
A1
Base to Seating Plane
3.683.302.92.145.130.115A2Molded Package Thickness
4.323.943.56.170.155.140ATop to Seating Plane
2.54.100
p
Pitch
1818
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
2
D
n
E1
c
eB
β
E
α
p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
§ Significant Characteristic