Datasheet

PIC16F610/616/16HV610/616

15.10 Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ T

A ≤ +125°C

Param

No.

Sym Characteristic Typ Units Conditions

TH01 θ

JA Thermal Resistance

Junction to Ambient

70* C/W 14-pin PDIP package

85.0* C/W 14-pin SOIC package

100* C/W 14-pin TSSOP package

37* C/W 16-pin QFN 4x4mm package

TH02 θ

JC Thermal Resistance

Junction to Case

32.5* C/W 14-pin PDIP package

31.0* C/W 14-pin SOIC package

31.7* C/W 14-pin TSSOP package

2.6* C/W 16-pin QFN 4x4mm package

TH03 T

DIE Die Temperature 150* C

TH04 PD Power Dissipation — W PD = P

INTERNAL + PI/O

TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD

(NOTE 1)

TH06 P

I/O I/O Power Dissipation — W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))

TH07 PDER Derated Power — W PDER = PDMAX (TDIE - TA)/θJA

(NOTE 2)

* These parameters are characterized but not tested.

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: T

A = Ambient Temperature.