Datasheet

 2010 Microchip Technology Inc. DS41326E-page 107
PIC16F526
16.0 PACKAGING INFORMATION
16.1 Package Marking Information
TABLE 16-1: 16-LEAD 3X3 QFN (MG) TOP MARKING
Part Number Marking
PIC16F526-I/MG MG1
PIC16F526-E/MG MG2
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead PDIP (300 mil)
14-Lead SOIC (3.90 mm)
XXXXXXXXXXX
YYWWNNN
Example
PIC16F526-E
0431017
XXXXXXXXXXX
14-Lead TSSOP (4.4 mm)
XXXXXXXX
YYWW
Example
16F526-I
0431
NNN
017
/SLG0125
Example
PIC16F526
0410017
0215
3
e
-I/PG
XXX
16-Lead QFN
YYWW
NNN
MG1
Example
0431
017
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard PIC
®
device marking consists of Microchip part number, year code, week code, and traceability
code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip
Sales Office. For QTP devices, any special marking adders are included in QTP price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
3
e
3
e