Datasheet

PIC12F508/509/16F505
DS41236B-page 88 Preliminary © 2005 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
840840
φ
Foot Angle
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.300.250.19.012.010.007BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length
5.105.004.90.201.197.193DMolded Package Length
4.504.404.30.177.173.169E1Molded Package Width
6.506.386.25.256.251.246EOverall Width
0.150.100.05.006.004.002A1Standoff §
0.950.900.85.037.035.033A2Molded Package Thickness
1.10.043AOverall Height
0.65.026
p
Pitch
1414
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
L
β
c
φ
2
1
D
n
B
p
E1
E
α
A2A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
§ Significant Characteristic