Datasheet

PIC16(L)F1946/47
DS41414D-page 402  2010-2012 Microchip Technology Inc.
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to Ambient
48.3 C/W 64-pin TQFP package
28 C/W 64-pin QFN package
TH02 
JC Thermal Resistance Junction to Case 26.1 C/W 64-pin TQFP package
0.24 C/W 64-pin QFN package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2),(3)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature
3: T
J = Junction Temperature