Datasheet

 2011-2013 Microchip Technology Inc. DS40001574C-page 453
PIC16(L)F1938/9
33.2 Package Details
The following sections give the technical details of the packages.

!"
 
 
 
 
 
!" 

 
   
  
  
    
    
    
    
    
    
    
    
    
    
    
NOTE 1
N
12
D
E1
eB
c
E
L
A2
eb
b1
A1
A
3
   