Datasheet

PIC16(L)F1938/9
DS40001574C-page 390  2011-2013 Microchip Technology Inc.
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 60.0 C/W 28-pin SPDIP package
69.7
C/W 28-pin SOIC package
71.0
C/W 28-pin SSOP package
27.5
C/W 28-pin UQFN 4x4mm package
31.1
C/W 28-pin QFN 6x6mm package
47.2
C/W 40-pin PDIP package
49.8
C/W 44-pin TQFP package
29.0
C/W 44-pin QFN 8x8mm package
TH02
JC Thermal Resistance Junction to Case 29.0 C/W 28-pin SPDIP package
18.9
C/W 28-pin SOIC package
24.0
C/W 28-pin SSOP package
24.0
C/W 28-pin UQFN 4x4mm package
5.0
C/W 28-pin QFN 6x6mm package
24.7
C/W 40-pin PDIP package
26.7
C/W 44-pin TQFP package
2.0
C/W 44-pin QFN 8x8mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature