Datasheet

PIC16(L)F1934/6/7
DS41364E-page 392  2008-2011 Microchip Technology Inc.
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to Ambient 60 C/W 28-pin SPDIP package
80 C/W 28-pin SOIC package
90 C/W 28-pin SSOP package
27.5 C/W 28-pin UQFN 4x4mm package
27.5 C/W 28-pin QFN 6x6mm package
47.2 C/W 40-pin PDIP package
46 C/W 44-pin TQFP package
24.4 C/W 44-pin QFN 8x8mm package
TH02 
JC Thermal Resistance Junction to Case 31.4 C/W 28-pin SPDIP package
24 C/W 28-pin SOIC package
24 C/W 28-pin SSOP package
24 C/W 28-pin UQFN 4x4mm package
24 C/W 28-pin QFN 6x6mm package
24.7 C/W 40-pin PDIP package
14.5 C/W 44-pin TQFP package
20 C/W 44-pin QFN 8x8mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature
3: T
J = Junction Temperature