Datasheet

PIC16(L)F1934/6/7
DS41364E-page 446  2008-2011 Microchip Technology Inc.
33.2 Package Details
The following sections give the technical details of the packages.

!"
 
 
 
 
 
!" 

 
   
  
  
    
    
    
    
    
    
    
    
    
    
    
NOTE 1
N
12
D
E1
eB
c
E
L
A2
eb
b1
A1
A
3
   