Datasheet
PIC16(L)F1847
DS40001453E-page 360 2011-2013 Microchip Technology Inc.
TABLE 30-8: OSCILLATOR PARAMETERS
FIGURE 30-6: HFINTOSC FREQUENCY ACCURACY OVER DEVICE V
DD AND TEMPERATURE
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym. Characteristic
Freq.
Tolerance
Min. Typ† Max. Units Conditions
OS08 HFOSC Internal Calibrated HFINTOSC
Frequency
(1)
2% — 16.0 — MHz 0°C TA +60°C, VDD 2.5V
3% — 16.0 — MHz 60°C TA +85°C, VDD 2.5V
5% — 16.0 — MHz -40°C TA +125°C
OS08A MF
OSC Internal Calibrated MFINTOSC
Frequency
(1)
2% — 500 — MHz 0°C TA +60°C, VDD 2.5V
3% — 500 — kHz 60°C TA +85°C, VDD 2.5V
5% — 500 — kHz -40°C TA +125°C
OS09 LF
OSC Internal LFINTOSC Frequency
(2)
——31—kHz
OS10* T
IOSC ST HFINTOSC
Wake-up from Sleep Start-up Time
MFINTOSC
Wake-up from Sleep Start-up Time
—
—
—
—
5
20
8
30
s
s
OS10A* T
LFOSC ST LFINTOSC
Wake-up from Sleep Start-up Time
— — 0.5 — ms -40°C TA +125°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as pos-
sible. 0.1
F and 0.01 F values in parallel are recommended.
2: See Figure 31-60: LFINTOSC Frequency over Vdd and Temperature, PIC16LF1847 only and
Figure 31-61: LFINTOSC Frequency over Vdd and Temperature, PIC16F1847 only.
125
25
2.0
0
60
85
V
DD (V)
4.0 5.04.5
Temperature (°C)
2.5
3.0
3.5 5.51.8
-40
-20
± 5%
± 2%
± 5%
± 3%