Datasheet

 2011-2013 Microchip Technology Inc. DS40001453E-page 357
PIC16(L)F1847
TABLE 30-6: THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 65.5 C/W 18-pin PDIP package
76.0
C/W 18-pin SOIC package
87.3
C/W 20-pin SSOP package
31.1
C/W 28-pin QFN (6x6mm) package
52.5
C/W 28-pin UQFN (4x4mm) package
TH02
JC Thermal Resistance Junction to Case 29.5 C/W 18-pin PDIP package
23.5
C/W 18-pin SOIC package
31.1
C/W 20-pin SSOP package
5.0
C/W 28-pin QFN (6x6mm) package
9.5
C/W 28-pin UQFN (4x4mm) package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD (Note 1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA (Note 2)
Note 1:
IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature; TJ = Junction Temperature