Datasheet

PIC16(L)F1826/27
DS41391D-page 352  2011 Microchip Technology Inc.
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to Ambient 65.5 C/W 18-pin PDIP package
76 C/W 18-pin SOIC package
89.3 C/W 20-pin SSOP package
TBD C/W 28-pin UQFN 4x4mm package
31.1 C/W 28-pin QFN 6x6mm package
TH02 
JC Thermal Resistance Junction to Case 29.5 C/W 18-pin PDIP package
23.5 C/W 18-pin SOIC package
31.1 C/W 20-pin SSOP package
TBD C/W 28-pin UQFN 4x4mm package
5 C/W 28-pin QFN 6x6mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Legend: TBD = To Be Determined
Note 1: I
DD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature
3: T
J = Junction Temperature