Datasheet

 2010-2012 Microchip Technology Inc. DS41419D-page 365
PIC16(L)F1824/1828
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to Ambient
70.0 C/W 14-pin PDIP package
95.3 C/W 14-pin SOIC package
100.0 C/W 14-pin TSSOP package
45.7 C/W 16-pin QFN (4x4mm) package
62.2 C/W 20-pin PDIP package
77.7 C/W 20-pin SOIC package
87.3 C/W 20-pin SSOP package
43.0 C/W 20-pin QFN (4x4mm) package
TH02 
JC
Thermal Resistance Junction to Case 32.8 C/W 14-pin PDIP package
31.0 C/W 14-pin SOIC package
24.4 C/W 14-pin TSSOP package
6.3 C/W 16-pin QFN (4x4mm) package
27.5 C/W 20-pin PDIP package
23.1 C/W 20-pin SOIC package
31.1 C/W 20-pin SSOP package
5.3 C/W 20-pin QFN (4x4mm) package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD (NOTE 1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA (NOTE 2, 3)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature
3: T
J = Junction Temperature