Datasheet

PIC12(L)F1822/PIC16(L)F1823
DS41413C-page 354  2010-2012 Microchip Technology Inc.
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to Ambient 89.3 C/W 8-pin PDIP package
149.5 C/W 8-pin SOIC package
56.7 C/W 8-pin DFN 3X3mm package
70.0 C/W 14-pin PDIP package
95.3 C/W 14-pin SOIC package
100 C/W 14-pin TSSOP 4x4mm package
45.7 C/W 16-pin QFN 4X4mm package
TH02 
JC Thermal Resistance Junction to Case 43.1 C/W 8-pin PDIP package
39.9 C/W 8-pin SOIC package
9.0 C/W 8-pin DFN 3X3mm package
32.0 C/W 14-pin PDIP package
31.0 C/W 14-pin SOIC package
24.4 C/W 14-pin TSSOP 4x4mm package
6.3 C/W 16-pin QFN 4X4mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Legend: TBD = To Be Determined
Note 1: I
DD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: T
J = Junction Temperature.