Datasheet

Table Of Contents
2011-2013 Microchip Technology Inc. DS41458C-page 313
PIC16(L)F1526/7
25.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01
JA Thermal Resistance Junction to
Ambient
48.3 C/W 64-pin TQFP (10x10 mm) package
28.0 C/W 64-pin QFN (9x9 mm) package
TH02
JC Thermal Resistance Junction to Case 26.1 C/W
64-pin TQFP (10x10 mm) package
1.2 C/W 64-pin QFN (9x9 mm) package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation W PI/O = (IOL * VOL) + (IOH * (VDD -
V
OH))
TH07 P
DER Derated Power W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature; TJ = Junction Temperature.