Datasheet

PIC16(L)F1516/7/8/9
DS41452C-page 292  2010-2012 Microchip Technology Inc.
25.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 69.7 C/W 28-pin SOIC package
60.0
C/W 28-pin SPDIP package
71.0
C/W 28-pin SSOP package
27.5
C/W 28-pin UQFN (4x4mm) package
47.2
C/W 40-pin PDIP package
41.0
C/W 40-pin UQFN (5x5mm) package
49.8
C/W 44-pin TQFP package
TH02
JC Thermal Resistance Junction to Case 18.9 C/W
28-pin SOIC package
29.0
C/W 28-pin SPDIP package
24.0
C/W 28-pin SSOP package
24.0
C/W 28-pin UQFN (4x4mm) package
24.7
C/W 40-pin PDIP package
5.5
C/W 40-pin UQFN (5x5mm) package
26.7
C/W 44-pin TQFP package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.