Datasheet

 2010-2012 Microchip Technology Inc. DS41452C-page 291
PIC16(L)F1516/7/8/9
25.5 Memory Programming Requirements
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym. Characteristic Min. Typ† Max. Units Conditions
Program Memory
Programming Specifications
D110
V
IHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2)
D111 I
DDP Supply Current during
Programming
——10mA
D112
VBE VDD for Bulk Erase 2.7 — VDDMAX V
D113 V
PEW VDD for Write or Row Erase VDDMIN — VDDMAX V
D114
IPPPGM Current on MCLR/VPP during Erase/
Write
—1.0—mA
D115
IDDPGM Current on VDD during Erase/Write —
5.0
—
mA
Program Flash Memory
D121 E
P Cell Endurance 10K — — E/W -40C to +85C (Note 1)
D122 V
PRW VDD for Read/Write
VDDMIN — VDDMAX
V
D123 T
IW Self-timed Write Cycle Time — 2 2.5 ms
D124 T
RETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
D125 E
HEFC High-Endurance Flash Cell 100K — — E/W 0C to +60C lower byte,
last 128 addresses
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Self-write and Block Erase.
2: Required only if single-supply programming is disabled.