Datasheet

 2010-2013 Microchip Technology Inc. DS40001452D-page 293
PIC16(L)F1516/7/8/9
TABLE 25-2: OSCILLATOR PARAMETERS
FIGURE 25-7: CLKOUT AND I/O TIMING
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No.
Sym. Characteristic
Freq.
Tolerance
Min. Typ† Max. Units Conditions
OS08 HFOSC Internal Calibrated HFINTOSC
Frequency
(1)
6.5% — 16.0 — MHz VDD = 3.0V at +25°C
(Note 2)
OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz (Note 3)
OS10* TIOSC ST HFINTOSC
Wake-up from Sleep Start-up Time — — 5 15
s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1
F and 0.01 F values in parallel are recommended.
2: See Figure 25-3: HFINTOSC Frequency Accuracy over VDD and Temperature.
3: See Figure 26-60 and Figure 26-61: LFINTOSC Frequency Characteristics over VDD and Temperature.
FOSC
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4
Q1
Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17
OS16
OS14
OS12
OS18
Old Value
New Value
Write Fetch Read ExecuteCycle