Datasheet

 2012 Microchip Technology Inc. Preliminary DS41624B-page 301
PIC16(L)F1512/3
D026 — 0.16 1 10 A 2.3 A/D Current (Note 1, Note 3), no
conversion in progress
— 0.40 2 11 A 3.0
— 0.50 6 16 A 5.0
Power-down Base Current (IPD)
(2),(4)
D026A* — 250 400 410 A 1.8 A/D Current (Note 1, Note 3),
conversion in progress
— 260 420 430
A3.0
D026A* — 280 430 440 A 2.3 A/D Current (Note 1, Note 3),
conversion in progress
— 300 450 460 A 3.0
— 320 470 480 A 5.0
25.3 DC Characteristics: PIC16(L)F1512/3-I/E (Power-Down) (Continued)
PIC16LF1512/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C
 TA  +125°C for extended
PIC16F1512/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C
 TA  +125°C for extended
Param
No.
Device Characteristics Min. Typ†
Max.
+85°C
Max.
+125°C
Units
Conditions
V
DD Note
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is
enabled. The peripheral
 current can be determined by subtracting the base IDD or IPD current from this limit. Max
values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD.
3: A/D oscillator source is FRC.
4: Specification for PIC16F1512/3 devices assumes that Low-Power Sleep mode is selected, when available, via the
VREGCON register (see
Section 8.2.2 “Peripheral Usage in Sleep” and Register 8-1).