Datasheet

 2012 Microchip Technology Inc. Preliminary DS41624B-page 299
PIC16(L)F1512/3
25.2 DC Characteristics: PIC16(L)F1512/3-I/E (Industrial, Extended) (Continued)
PIC16LF1512/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C
 TA  +125°C for extended
PIC16F1512/3
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C
 TA  +125°C for extended
Param
No.
Device
Characteristics
Min. Typ† Max. Units
Conditions
V
DD Note
Supply Current (I
DD)
(1, 2)
D020 — 1.0
1.8
mA 3.0 FOSC = 20 MHz
HS Oscillator mode
—1.2
2.1
mA 3.6
D020 — 1.4
1.7
mA 3.0 FOSC = 20 MHz
HS Oscillator mode
— 1.7
2.1
mA 5.0
D021 — 150
220
A1.8FOSC = 4 MHz
EXTRC mode
— 250
380
A3.0
D021 — 200
330
A 2.3 FOSC = 4 MHz
EXTRC mode
— 280
420
A 3.0
— 350
500
A 5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to V
DD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula I
R = VDD/2REXT (mA) with REXT in k