Datasheet

 2011-2013 Microchip Technology Inc. DS40001609B-page 333
PIC16(L)F1508/9
TABLE 29-6: THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Sym. Characteristic Typ. Units Conditions
TH01
JA Thermal Resistance Junction to Ambient 62.2 C/W 20-pin DIP package
77.7
C/W 20-pin SOIC package
87.3
C/W 20-pin SSOP package
43
C/W 20-pin QFN 4X4mm package
TH02
JC Thermal Resistance Junction to Case 27.5 C/W
20-pin DIP package
23.1
C/W 20-pin SOIC package
31.1
C/W 20-pin SSOP package
5.3
C/W 20-pin QFN 4X4mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature; TJ = Junction Temperature