Datasheet

Table Of Contents
PIC16(L)F1508/9
DS40001609C-page 86 2011-2013 Microchip Technology Inc.
FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT
8.2 Low-Power Sleep Mode
This device contains an internal Low Dropout (LDO)
voltage regulator, which allows the device I/O pins to
operate at voltages up to 5.5V while the internal device
logic operates at a lower voltage. The LDO and its
associated reference circuitry must remain active when
the device is in Sleep mode.
Low-Power Sleep mode allows the user to optimize the
operating current in Sleep. Low-Power Sleep mode can
be selected by setting the VREGPM bit of the
VREGCON register, putting the LDO and reference
circuitry in a low-power state whenever the device is in
Sleep.
8.2.1 SLEEP CURRENT VS. WAKE-UP
TIME
In the Default Operating mode, the LDO and reference
circuitry remain in the normal configuration while in
Sleep. The device is able to exit Sleep mode quickly
since all circuits remain active. In Low-Power Sleep
mode, when waking up from Sleep, an extra delay time
is required for these circuits to return to the normal con-
figuration and stabilize.
The Low-Power Sleep mode is beneficial for applica-
tions that stay in Sleep mode for long periods of time.
The Normal mode is beneficial for applications that
need to wake from Sleep quickly and frequently.
8.2.2 PERIPHERAL USAGE IN SLEEP
Some peripherals that can operate in Sleep mode will
not operate properly with the Low-Power Sleep mode
selected. The LDO will remain in the Normal-Power
mode when those peripherals are enabled. The Low-
Power Sleep mode is intended for use with these
peripherals:
Brown-Out Reset (BOR)
Watchdog Timer (WDT)
External interrupt pin/Interrupt-on-change pins
Timer1 (with external clock source)
The Complementary Waveform Generator (CWG), the
Numerically Controlled Oscillator (NCO) and the Con-
figurable Logic Cell (CLC) modules can utilize the
HFINTOSC oscillator as either a clock source or as an
input source. Under certain conditions, when the
HFINTOSC is selected for use with the CWG, NCO or
CLC modules, the HFINTOSC will remain active
during Sleep. This will have a direct effect on the
Sleep mode current.
Please refer to sections Section 24.5 “Operation
During Sleep”, Section 25.7 “Operation In Sleep”
and Section 26.10 “Operation During Sleep” for
more information.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN
(1)
CLKOUT
(2)
Interrupt flag
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC - 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency
(4)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h)
Inst(0005h)
Inst(0004h)
Forced NOP
PC + 2 0004h 0005h
Forced NOP
T1
OSC
(3)
PC + 2
Note 1: External clock. High, Medium, Low mode assumed.
2: CLKOUT is shown here for timing reference.
3: T1OSC; See Section 29.0 “Electrical Specifications”.
4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
Note: The PIC16LF1508/9 does not have a con-
figurable Low-Power Sleep mode.
PIC16LF1508/9 is an unregulated device
and is always in the lowest power state
when in Sleep, with no wake-up time pen-
alty. This device has a lower maximum
V
DD and I/O voltage than the
PIC16F1508/9. See Section 29.0 “Elec-
trical Specifications” for more informa-
tion.