Datasheet

Table Of Contents
2011-2013 Microchip Technology Inc. DS40001609C-page 329
PIC16(L)F1508/9
D015 3.2 12 A1.8FOSC = 31 kHz,
LFINTOSC,
-40°C TA +85°C
—5.420 A3.0
D015 13 28 A 2.3 FOSC = 31 kHz,
LFINTOSC,
-40°C TA +85°C
15 30 A 3.0
17 36 A 5.0
D016 215 360 A1.8FOSC = 500 kHz,
HFINTOSC
275 480 A3.0
D016 270 450 A 2.3 FOSC = 500 kHz,
HFINTOSC
300 500 A 3.0
350 620 A 5.0
D017* 410 660 A1.8F
OSC = 8 MHz,
HFINTOSC
630 970 A3.0
D017* 530 750 A 2.3 FOSC = 8 MHz,
HFINTOSC
660 1100 A 3.0
730 1200 A 5.0
D018 600 940 A1.8FOSC = 16 MHz,
HFINTOSC
970 1400 A3.0
D018 780 1200 A 2.3 FOSC = 16 MHz,
HFINTOSC
1000 1550 A 3.0
1090 1700 A 5.0
D019A 1030 1500 A3.0FOSC = 20 MHz,
External Clock (ECH),
High-Power mode
D019A 1060 1600 A 3.0 FOSC = 20 MHz,
External Clock (ECH),
High-Power mode
1220 1800 A 5.0
TABLE 29-2: SUPPLY CURRENT (IDD)
(1,2)
(CONTINUED)
PIC16LF1508/9
Standard Operating Conditions (unless otherwise stated)
PIC16F1508/9
Param.
No.
Device
Characteristics
Min. Typ† Max. Units
Conditions
V
DD Note
* These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all I
DD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to V
SS; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
3: For EXTRC oscillator configurations, current through R
EXT is not included. The current through the resis-
tor can be extended by the formula IR = V
DD/2REXT (mA) with REXT in k.