Datasheet

Table Of Contents
PIC16(L)F1508/9
DS40001609C-page 328 2011-2013 Microchip Technology Inc.
TABLE 29-2: SUPPLY CURRENT (IDD)
(1,2)
PIC16LF1508/9
Standard Operating Conditions (unless otherwise stated)
PIC16F1508/9
Param.
No.
Device
Characteristics
Min. Typ† Max. Units
Conditions
V
DD Note
D010 8 20 A1.8F
OSC = 32 kHz,
LP Oscillator,
-40°C TA +85°C
—1025A3.0
D010 15 31 A 2.3 FOSC = 32 kHz,
LP Oscillator,
-40°C TA +85°C
17 33 A 3.0
21 39 A 5.0
D011 60 100 A1.8FOSC = 1 MHz,
XT Oscillator
100 180 A3.0
D011 100 180 A 2.3 FOSC = 1 MHz,
XT Oscillator
130 220 A 3.0
170 280 A 5.0
D012 140 240 A1.8F
OSC = 4 MHz,
XT Oscillator
250 360 A3.0
D012 210 320 A 2.3 FOSC = 4 MHz,
XT Oscillator
280 410 A 3.0
340 500 A 5.0
D013 30 65 A1.8FOSC = 1 MHz,
External Clock (ECM),
Medium-Power mode
—55100A3.0
D013 65 110 A 2.3 FOSC = 1 MHz,
External Clock (ECM),
Medium-Power mode
85 140 A 3.0
115 190 A 5.0
D014 115 190 A1.8FOSC = 4 MHz,
External Clock (ECM),
Medium-Power mode
210 310 A3.0
D014 180 270 A 2.3 FOSC = 4 MHz,
External Clock (ECM),
Medium-Power mode
240 365 A 3.0
295 460 A 5.0
* These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all I
DD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to V
SS; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
3: For EXTRC oscillator configurations, current through R
EXT is not included. The current through the resis-
tor can be extended by the formula IR = V
DD/2REXT (mA) with REXT in k.