Datasheet

 2012 Microchip Technology Inc. Preliminary DS41639A-page 365
PIC16(L)F1454/5/9
29.7 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 70 C/W 14-Pin PDIP package
95.3
C/W 14-Pin SOIC package
100
C/W 14-Pin TSSOP package
45.7
C/W 16-Pin QFN 4x4mm package
62.2
C/W 20-pin PDIP package
77.7
C/W 20-pin SOIC package
87.3
C/W 20-pin SSOP package
43.0
C/W 20-pin QFN 4x4mm package
TH02
JC Thermal Resistance Junction to Case 32 C/W
14-Pin PDIP package
31
C/W
14-Pin SOIC package
24.4
C/W
14-Pin TSSOP package
6.3
C/W
16-Pin QFN 4x4mm package
27.5
C/W
20-pin PDIP package
23.1
C/W 20-pin SOIC package
31.1
C/W 20-pin SSOP package
5.3
C/W 20-pin QFN 4x4mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature