Datasheet

PIC16C9XX
DS30444E - page 174  1997 Microchip Technology Inc.
19.4 Package Marking Information
Legend:
MM...M
XX...X
AA
BB
C
D
1
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calender year)
Week code (week of January 1 is week '01’)
Facility code of the plant at which wafer is manufactured.
C = Chandler, Arizona, U.S.A.
Mask revision number for microcontroller
Assembly code of the plant or country of origin in which
part was assembled.
In the event the full Microchip part number cannot be marked on one
line, it will be carried over to the next line thus limiting the number of
available characters for customer specific information.
Note:
Standard OTP marking consists of Microchip part number, year code, week code,
facility code, mask revision number, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
*
68-Lead PLCC
MMMMMMMMMM
MMMMMMM
AABBCDE
Example
S = Tempe, Arizona, U.S.A.
64-Lead TQFP
MMMMMMM
AABBCDE
MMMMMMMMMM
Example
9712CAE
68-Lead CERQUAD Windowed Example
AABBCDE
64-Lead SDIP (Shrink DIP)
MMMMMMMMMMMMMMMMM
Example
PIC16C924
-08/L
9648CAE
MMMMMMMMMMMMMMMMM
AABBCDE
PIC16C924-04/CL
9650CAE
-08I/PT
PIC16C923
9736CAE
PIC16C924-04I/SP