Datasheet

PIC16C9XX
DS30444E - page 142  1997 Microchip Technology Inc.
17.1 DC Characteristics: PIC16C923/924-04 (Commercial, Industrial)
PIC16C923/924-08 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ T
A ≤ +70˚C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage V
DD 4.0
4.5
-
-
6.0
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
V
DR - 1.5 - V
D003 V
DD start voltage to
ensure internal
Power-on Reset signal
VPOR - VSS - V See Power-on Reset section for details
D004* V
DD rise rate to ensure
internal Power-on
Reset signal
SVDD 0.05 - - V/ms (Note 6) See Power-on Reset section for
details
D010
D011
D012
Supply Current (Note 2) I
DD -
-
-
2.7
22.5
3.5
5
48
7
mA
µA
mA
XT and RC osc configuration
F
OSC = 4 MHz, VDD = 5.5V (Note 4)
LP osc configuration,
F
OSC = 32 kHz, VDD = 4.0V
HS osc configuration
F
OSC = 8 MHz, VDD = 5.5V
D020 Power-down Current
(Note 3)
I
PD - 1.5 21 µA VDD = 4.0V
Module Differential Cur-
rent (Note 5)
D021 Watchdog Timer
∆IWDT - 6.0 20 µA VDD = 4.0V
D022* LCD Voltage Generation
w/internal RC osc
enabled
∆ILCDRC - 40 55 µA VDD = 4.0V (Note 7)
D024* LCD Voltage Generation
w/Timer1 @ 32.768 kHz
∆ILCDT1 - 33 60 µA VDD = 4.0V (Note 7)
D025* Timer1 oscillator
∆IT1OSC - 10.6 17 µA VDD = 4.0V
D026* A/D Converter
∆IAD - 1.0 - µA A/D on, not converting
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD
MCLR
= VDD.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
6: PWRT must be enabled for slow ramps.
7: ∆Ι
LCDT1 and ∆ΙLCDRC includes the current consumed by the LCD Module and the voltage generation cir-
cuitry. This does not include current dissipated by the LCD panel.