Datasheet

PIC16C77X
DS30275B-page 184 Advance Information  1999-2013 Microchip Technology Inc.
17.9 K04-071 44-Lead Plastic Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
JEDEC equivalent:MS-022 AB
0.025
0.390
0.390
0.510
0.510
0.012
0.005
0.011
0.015
0.005
0.005
0.002
0.032
0.079
pPitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Pin 1 Corner Chamfer
Molded Pack. Width
Molded Pack. Length
Outside Tip Width
Outside Tip Length
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Shoulder Height
Overall Pack. Height
Pins along Width
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins


X
E
‡
D
‡
c

A2
A1
A
n1
n
R2
E1
D1
B
†
L1
L
R1
Dimension Limits
Units
MIN
0.800.031
0.635
12.95
12.95
0.035
0.394
0.394
5
5
10
12 15
15
0.045
0.398
0.398
0.012
0.520
0.520
0.015
0.007
0.016
0.020
03.5
0.005
0.006
0.044
0.086
11
44
0.015
0.009
0.530
0.530
0.018
0.021
0.025
7
0.010
0.010
0.056
0.093
5
5
9.90
9.90
10
12
10.00
10.00
0.89 1.143
10.10
10.10
15
15
0.300.13
0.13
0.30
0
0.28
0.38
0.18
13.20
13.20
0.37
3.5
0.41
0.51
0.13
0.05
0.81
2.00
0.13
0.15
1.11
11
2.18
44
0.38
13.45
13.45
0.45
0.23
0.53
0.64
7
0.25
0.25
1.41
2.35
MINNOM
INCHES
MAX
MILLIMETERS*
NOM MAX
X x 45°
n
1
2
R2
R1
D
D1
B
p
E1
E
# leads = n1
L1
L
c



A1
A
A2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 184 Tuesday, January 29, 2013 12:02 PM