Information

DS80011C-page 6

1999 Microchip Technology Inc.
PIC16C773
Clarifications/Corrections to the Data Sheet:
In the Device Data Sheet (DS30275A), the following clar-
ifications and corrections should be noted.
The typical A/D converter supply current (parameter
D026) should be the value indicated in Table 15-1 and
Table 15-2 below.
15.1 DC Characteristics: PIC16C77X (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +85°C for industrial and
0°C ≤ T
A ≤ +70°C for commercial
Param
No.
Characteristic Sym Min Typ† Max Units Conditions
D001
D001A
Supply Voltage V
DD 4.0
4.5
—
—
5.5
5.5
V
V
XT, RC and LP osc configuration
HS osc configuration
D002* RAM Data Retention
Voltage (Note 1)
V
DR —1.5—V
D003 V
DD start voltage to
ensure internal Power-on
Reset signal
VPOR —VSS — V See section on Power-on Reset for details
D004* V
DD rise rate to ensure
internal Power-on Reset
signal
SVDD 0.05 — — V/ms See section on Power-on Reset for details.
PWRT enabled
D010
D013
Supply Current (Note 2) I
DD —
—
2.7
13.5
5
30
mA
mA
XT, RC osc configuration
F
OSC = 4 MHz, VDD = 5.5V (Note 4)
HS osc configuration
F
OSC = 20 MHz, VDD = 5.5V
D020
D020A
Power-down Current
(Note 3)
I
PD —
—
1.5
1.5
16
19
µA
µA
VDD = 4.0V, -0°C to +70°C
V
DD = 4.0V, -40°C to +85°C
Module Differential Cur-
rent (Note 5)
D021 Watchdog Timer ∆I
WDT —6.020µAVDD = 4.0V
D023B* Bandgap voltage
generator
∆I
BG
6
—40µATBD µA
D025* Timer1 oscillator ∆I
T1OSC —59µAVDD = 4.0V
D026* A/D Converter ∆I
AD — 70 — µAVDD = 5.5V, A/D on, not converting
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD.
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2Rext (mA) with Rext in kOhm.
5: The ∆ current is the additional current consumed when the peripheral is enabled. This current should be
added to the base (IPD or IDD) current.
6: The bandgap voltage reference provides 1.22V to the VRL, VRH, LVD and BOR circuits. When calculating
current consumption, use the following formula: ∆IVRL + ∆IVRH + ∆ILVD + ∆IBOR + ∆IBG. Any of the ∆IVRL,
∆I
VRH, ∆ILVD or ∆IBOR can be 0.