Datasheet

PIC16C77X
 1999-2013 Microchip Technology Inc. Advance Information DS30275B-page 179
17.4 K04-052 28-Lead Plastic Small Outline (SO) – Wide, 300 mil
MIN
pPitch
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Radius Centerline
Gull Wing Radius
Shoulder Radius
Chamfer Distance
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Lead Thickness
Foot Angle
Foot Length
Standoff
Number of Pins


B
†
c

X
A2
A1
A
n
E1
L
L1
R1
R2
E
‡
D
‡
Dimension Limits
Units
1.270.050
8
12
12
0.017
0
0.014
0
0.019
15
15
0.011
0.015
0.016
0.005
0.005
0.020
0.407
0.296
0.706
0.008
0.058
0.099
28
0.394
0.011
0.009
0.010
0
0.005
0.005
0.010
0.292
0.700
0.004
0.048
0.093
0.419
0.012
0.020
0.021
0.010
0.010
0.029
48
0.299
0.712
0.011
0.068
0.104
0.36
0
0
12
12
0.42
15
15
0.48
10.33
17.93
10.01
0.23
0.25
0.28
0.13
0.13
0.25
0
7.42
0.10
1.22
2.36
17.78
10.64
0.41
4
0.27
0.38
0.13
0.13
0.50
0.53
0.30
0.51
0.25
0.25
0.74
7.51
0.19
28
2.50
1.47
18.08
7.59
0.28
2.64
1.73
NOM
INCHES*
MAX NOM
MILLIMETERS
MIN MAX
n
1
2
R1
R2
D
p
B
E1
E
L1
L
c

45
°
X

A1

A
A2
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 179 Tuesday, January 29, 2013 12:02 PM