Information

 2001 Microchip Technology Inc. DS80061C-page 7
PIC16C773
3. The PIC16C77X devices contain new package
marking information. The package marking
details provided below replace those given in
Section 17 of the Device Data Sheet
(DS30275A).
15.1 Package Marking Information
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead PDIP (Skinny DIP) Example
YYWWNNN
XXXXXXXXXXXX
XXXXXXXXXXXX
28-Lead SSOP Example
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
28-Lead CERDIP Windowed
XXXXXXXXXXX
PIC16C773
Example
9910017
XXXXXXXXXXX
9910017
PIC16C773/SP
XXXXXXXXXXXXXXXXXXXX
9910017
PIC16C773/SO
9910017
PIC16C773
Legend: XX...X Customer specific information*
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code and traceability code.
For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
I/SS
/JW