Manualshelf

Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller SOIC 28 8-Bit 20 MHz I/O number 22
181182183184185186187188189190
PIC16C77X
1999-2013 Microchip Technology Inc. Advance Information DS30275B-page 185
17.10 K04-048 44-Lead Plastic Leaded Chip Carrier (L) – Square
*
Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions “D” or “E.”
JEDEC equivalent:MO-047 AC
0.015
0.003
0.050
0.015
0.026
0.008
0.610
0.610
0.650
0.650
0.685
0.685
0.000
0.040
0.024
0.015
0.095
0.165
MIN
pPitch
Mold Draft Angle Bottom
Mold Draft Angle Top
J-Bend Inside Radius
Shoulder Inside Radius
Upper Lead Length
Lower Lead Width
Upper Lead Width
Lead Thickness
Pins along Width
Footprint Length
Footprint Width
Molded Pack. Length
Molded Pack. Width
Overall Pack. Length
Overall Pack. Width
Corner Chamfer (other)
Corner Chamfer (1)
Side 1 Chamfer Dim.
Shoulder Height
Overall Pack. Height
Standoff
R2
R1
L
B
B1
†
D2
E2
CH2
CH1
A3
A2
E1
c
n1
E
‡
D
‡
D1
A1
A
Number of Pins
Dimension Limits
Units
n
1.270.050
0
0
0.005
0.025
5
5
0.058
0.018
0.029
0.035
0.010
0.065
0.021
0.032
10
10
0.690
0.620
0.010
0.620
11
0.653
0.653
0.690
0.005
0.045
0.029
0.023
0.103
0.173
0.695
0.012
0.630
0.630
0.656
0.656
0.695
0.010
0.050
0.034
0.030
0.110
0.180
0.64
0.13
1.46
0.46
0.74
0.08
0.38
0
0
1.27
0.38
0.66
5
5
0.25
0.89
10
10
1.65
0.53
0.81
0.25
15.75
15.75
16.59
16.59
17.53
17.53
0.13
1.14
0.74
0.57
2.60
4.38
17.40
15.49
0.20
15.49
16.51
16.51
17.40
0.00
1.02
0.61
0.38
2.41
4.19
17.65
11
16.00
0.30
16.00
16.66
16.66
17.65
0.25
1.27
0.86
0.76
2.79
4.57
INCHES*
NOM
44
MAX
MILLIMETERS
MIN NOM MAX
44
1
CH2 x 45°
n
CH1 x 45°
2
R2
A1
R1
c
E2
D1
D
# leads = n1
E1
E
p
L
A3
A2
A
35°
B1
B
D2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 185 Tuesday, January 29, 2013 12:02 PM