Datasheet

PIC16C77X
 1999-2013 Microchip Technology Inc. Advance Information DS30275B-page 183
17.8 K04-076 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.1 mm Lead Form
0.025
0.390
0.390
0.463
0.463
0.012
0.004
0.003
0.005
0.003
0.003
0.002
0.015
0.039
p
Mold Draft Angle Bottom
Mold Draft Angle Top
Pin 1 Corner Chamfer
Molded Pack. Width
Molded Pack. Length
Outside Tip Width
Outside Tip Length
Lower Lead Width
Lead Thickness
Radius Centerline
Gull Wing Radius
Shoulder Radius
Shoulder Height
Overall Pack. Height
Pins along Width
Number of Pins
Foot Length
Foot Angle
Standoff
D
‡

X

E
‡
L
D1
E1
B
†
c
L1

A1
R1
R2
A2
n1
A
n
Dimension Limits
Pitch
Units
MIN
0.3980.394
5
5
12
0.035
0.394
10
0.045
0.398
15
15
0.010
0
0.472
0.472
0.015
0.006
0.008
3.5
0.025
0.006
0.003
0.004
0.043
11
44
0.015
0.482
0.482
0.018
0.008
0.013
7
0.008
0.010
0.006
0.035
0.047
10.1010.009.90
12
10
0.89
10.00
5
0.64
9.90
5
15
15
1.14
10.10
12.00
12.00
0.38
0.15
0.20
3.5
0.25
0.14
0.08
0.10
0.64
1.10
11
44
0.13
11.75
11.75
0.30
0.09
0.08
0
0.38
0.08
0.08
0.05
1.00
0.38
12.25
12.25
0.45
0.20
0.33
7
0.89
0.20
0.25
0.15
1.20
MINNOM
INCHES
0.031
MAX
0.80
MILLIMETERS*
NOM MAX
X x 45°
n
1
2
R2
R1
L1
L

c

D1D
B
p
# leads = n1
E
E1

A1
A2
A
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
JEDEC equivalent:MS-026 ACB
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 183 Tuesday, January 29, 2013 12:02 PM