Datasheet

PIC16C77X
DS30275B-page 182 Advance Information  1999-2013 Microchip Technology Inc.
17.7 K04-014 40-Lead Ceramic Dual In-line with Window (JW) – 600 mil
*
Controlling Parameter.
n
1
2
R
Window Diameter
Overall Row Spacing
Radius to Radius Width
Package Width
Package Length
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Lead Thickness
Shoulder Radius
Upper Lead Width
Lower Lead Width
Number of Pins
PCB Row Spacing
Dimension Limits
Pitch
E1
W
eB
D
E
L
A2
A1
A
c
p
B1
R
B
n
9.14
18.03
15.24
13.36
52.32
3.68
3.89
5.59
0.36
0.25
0.58
2.59
MAX
0.0140.0110.008
0.350
0.660
0.580
0.520
2.050
0.140
0.045
0.135
0.205
0.560
0.340
0.610
0.514
2.040
0.135
0.030
0.117
0.190
0.600
0.360
0.710
0.526
2.060
0.145
0.060
0.153
0.220
0.005
0.053
0.020
0.100
0.600
NOM
0.000
0.050
0.016
0.098
MIN
40
0.102
0.010
0.055
0.023
MAX
0.280.20
14.22
15.49
8.64
13.06
51.82
3.43
0.00
2.97
4.83
14.73
16.76
8.89
13.21
52.07
3.56
1.14
3.43
5.21
MIN
2.49
1.27
0.00
0.41
2.54
1.33
0.13
0.50
15.24
NOM
40
1.52
1.40
D
W
E
c
eB
E1
p
L
A1
B1
B
A
A2
Units INCHES* MILLIMETERS
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 182 Tuesday, January 29, 2013 12:02 PM