Datasheet

PIC16C77X
 1999-2013 Microchip Technology Inc. Advance Information DS30275B-page 181
17.6 K04-016 40-Lead Plastic Dual In-line (P) – 600 mil
* Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
n
2
1
R
Top to Seating Plane
Mold Draft Angle Bottom
Mold Draft Angle Top
Overall Row Spacing
Radius to Radius Width
Molded Package Width
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Package Length
E1

eB

L
E
‡
D
‡
A2
A1
0.670
0.585
0.540
2.023
0.135
0.040
0.113
0.545
5
5
0.630
0.125
0.530
2.013
0.020
0.073
0.565
10
0.610
10
0.130
0.535
2.018
0.020
0.093
16.00
13.84
13.46
51.13
3.18
0.51
1.85
15
15
14.35
5
5
10
15.49
10
3.30
13.59
51.26
0.51
2.36
14.86
17.02
15
15
13.72
51.38
3.43
1.02
2.87
PCB Row Spacing
Lead Thickness
Shoulder Radius
Upper Lead Width
Lower Lead Width
Pitch
Number of Pins
Dimension Limits
Units
p
c
A
R
B
B1
†
n
0.160
0.011
0.010
0.055
0.020
NOM
INCHES*
0.110
0.009
0.000
0.045
0.016
MIN
0.100
0.160
0.010
0.005
0.050
0.018
40
0.600
MAX
2.79
0.23
0.00
1.14
0.41
MIN
2.54
4.06
0.25
0.13
1.27
0.46
NOM
MILLIMETERS
15.24
40
4.06
0.28
0.25
1.40
0.51
MAX
A1
D
E
c

eB
E1

p
L
B
B1
A
A2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 181 Tuesday, January 29, 2013 12:02 PM