Datasheet

PIC16C77X
DS30275B-page 180 Advance Information  1999-2013 Microchip Technology Inc.
17.5 K04-073 28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm
Dimension Limits
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Lead Thickness
Radius Centerline
Gull Wing Radius
Shoulder Radius
Outside Dimension
Molded Package Width
Molded Package Length
Shoulder Height
Overall Pack. Height
Number of Pins
Foot Angle
Foot Length
Standoff
Pitch


B
†
E
‡
L
c
L1

R1
R2
E1
A2
D
‡
A1
A
n
p
Units
MAXNOMMINMAXNOMMIN
10
10
0.38
0.22
0.25
0.64
0.25
0.25
7.90
5.38
10.33
0.21
1.17
1.99
0.012
0
0.010
0
5
5
10
0.015
10
0.007
0.005
0.020
0.005
0.005
0.306
0.208
0.402
0.005
0.036
0.073
0.026
0.205
0.015
0.005
0.000
0
0.005
0.005
0.301
0.396
0.002
0.026
0.068
0.212
4
0.025
0.009
0.010
8
0.010
0.010
0.311
28
0.407
0.008
0.046
0.078
0.25
0
0
5
0.32
5
5.20
0.13
0.00
0.38
0.13
0.13
7.65
0
10.07
0.05
0.66
1.73
5.29
0.51
0.18
0.13
4
0.13
0.13
7.78
10.20
0.13
0.91
1.86
0.65
28
8
INCHES MILLIMETERS*
n
1
2
R1
R2
D
p
B
E
E1
L
L1

c


A1
A2
A
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 180 Tuesday, January 29, 2013 12:02 PM