Datasheet

PIC16C77X
DS30275B-page 178 Advance Information  1999-2013 Microchip Technology Inc.
17.3 K04-080 28-Lead Ceramic Dual In-line with Window (JW) – 300 mil
* Controlling Parameter.
n 1
2
R
Overall Row Spacing
Radius to Radius Width
Package Length
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Shoulder Radius
Upper Lead Width
Lower Lead Width
PCB Row Spacing
Dimension Limits
Window Width
Window Length
Package Width
Lead Thickness
Pitch
Number of Pins
Units
0.170A
0.130W1
W2 0.290
D
E1
eB
E
A2
L
A1
1.430
0.345
0.255
0.285
0.135
0.015
0.107
B
R
c
B1
n
p
0.016
0.008
0.010
0.050
0.098
MIN
MILLIMETERS
4.320.1950.183
0.310
0.150
0.425
0.285
0.295
1.485
0.145
0.030
0.143
0.140
0.300
0.385
0.270
0.290
1.458
0.140
0.023
0.125
0.13
0.29
36.32
8.76
6.48
7.24
3.43
0.00
2.72
0.012
0.015
0.065
0.021
0.102
MAXNOM
0.010
0.013
0.058
0.019
0.100
0.300
28
INCHES*
0.41
0.20
0.25
1.27
2.49
MIN
4.954.64
0.31
0.15
10.80
7.24
7.49
37.72
3.68
0.76
3.63
0.14
0.3
37.02
6.86
9.78
7.37
0.57
3.56
3.18
0.30
0.38
1.65
0.53
2.59
NOM
28
0.47
0.32
0.25
1.46
2.54
7.62
MAX
D
W2
W1
E
c
E1
eB
p
A1
L
B1
B
A2
A
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 178 Tuesday, January 29, 2013 12:02 PM