Datasheet

PIC16C77X
 1999-2013 Microchip Technology Inc. Advance Information DS30275B-page 177
17.2 K04-070 28-Lead Skinny Plastic Dual In-line (SP) – 300 mil
* Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
0.320
0.270
0.280
1.345
0.125
0.015
0.070
0.140
0.008
0.000
0.040
0.016
Mold Draft Angle Bottom
Mold Draft Angle Top
Overall Row Spacing
Radius to Radius Width
Molded Package Width
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Upper Lead Width
Lower Lead Width
PCB Row Spacing
Package Length
Lead Thickness
Shoulder Radius
Number of Pins
Dimension Limits
Pitch
Units
E
‡

eB
E1

A1
A2
L
D
‡
A
c
R
n
B1
†
B
p
MIN MIN
0.2950.288
5
5
10
0.350
0.283
10
0.380
0.295
15
15
0.090
1.365
0.130
0.020
0.150
0.010
0.005
NOM
INCHES*
28
0.053
0.019
0.100
0.300
1.385
0.135
0.025
0.110
0.160
0.012
0.010
0.065
0.022
MAX
7.497.307.11
8.89
7.18
5
8.13
6.86
5
10
10
15
15
9.65
7.49
34.67
3.30
0.51
2.29
3.81
0.25
0.13
1.33
0.48
2.54
7.62
MILLIMETERS
1.78
34.16
3.18
0.38
3.56
0.20
0.00
1.02
0.41
NOM
2.79
35.18
3.43
0.64
4.06
0.30
0.25
MAX
28
1.65
0.56
n 1
2
R
D
E
c
eB

E1

p
L
A1
B
B1
A
A2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
774.book Page 177 Tuesday, January 29, 2013 12:02 PM