Datasheet

PIC16C77X
 1999-2013 Microchip Technology Inc. Advance Information DS30275B-page 175
17.0 PACKAGING INFORMATION
17.1 Package Marking Information
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXXXXXX
AABBCDE
Example
PIC16C773-20/SO
XXXXXXXXXXXXXXXXXXXX
AABBCDE
28-Lead PDIP (Skinny DIP) Example
PIC16C773-20/SP
1317HAT
1310SAA
AABBCAE
XXXXXXXXXXXX
XXXXXXXXXXXX
28-Lead SSOP
9817SBP
20I/SS
PIC16C773
Example
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA Year code (last 2 digits of calendar year)
BB Week code (week of January 1 is week ‘01’)
C Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
D Mask revision number
E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
28-Lead CERDIP Windowed
XXXXXXXXXXX
PIC16C774/JW
Example
1305HAT
XXXXXXXXXXX
774.book Page 175 Tuesday, January 29, 2013 12:02 PM